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Siemens brings secure thermal digital twin technology to the electronics supply chain

Plano, Texas, USA

Siemens’ Embeddable BCI-ROM technology enables accurate reduced order thermal models of IC packages to be shared for 3D CFD thermal analysis in the electronics supply chain.
  • For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property
  • Siemens’ Embeddable BCI-ROM technology provides reduced order models for the 3D CFD thermal simulation environment that maintains high accuracy in comparison to traditional fully detailed thermal models

Siemens Digital Industries Software announced today that it is bringing an innovative approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies.

Introduced in the latest updates to Simcenter™ Flotherm™ software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the breakthrough Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.

MediaTek Inc., a global fabless semiconductor company and market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and Internet of Things (IoT) products, has taken advantage of Simcenter Flotherm to drive efficiency in its collaboration with customers. “Embeddable BCI-ROM is a great way to share our thermal models with our customers. It has several key features: easy generation, confidentiality, low error rate, and suitability for steady-state and transient applications,” said Jimmy Lin, Technical Manager, MediaTek Inc.

Today’s electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, or demanding processing requirements. As a result, the need for more detailed thermal models to help solve thermal management design tasks is growing. Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.

“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. “Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly.”

To learn more about Siemens’ Embeddable BCI-ROM technology and how it can enable more efficient and secure collaboration, visit: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/

西门子数字化工业软件通过Siemens Xcelerator 数字商业平台的软件、硬件和服务,帮助各规模企业实现数字化转型。西门子全栈式工业软件和全面的数字孪生可助力企业优化设计、工程与制造流程,将创新想法变为可持续的产品,从芯片到系统,从产品到制造,跨越所有行业,创造数字价值。Siemens Digital Industries Software – Accelerating transformation.

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