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Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology

March 16, 2022
Plano, Texas, USA

Customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPCᵁ+ process for their next-generation analog/mixed-signal designs.

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPCU+ process for their next-generation analog/mixed-signal designs.

“We continue to have a strong collaboration with UMC to provide comprehensive support for UMC’s process technologies for our mutual customers,” said Ravi Subramanian, senior vice president and general manager of IC Verification Solutions, Siemens Digital Industries Software. “Our Analog FastSPICE simulation technology complements UMC’s 28HPCU+ processes by providing our mutual customers with a highly accurate, high-performance verification solution. We look forward to our continued partnership with UMC for a wide range of technology nodes.”

Siemens‘ Analog FastSPICE platform provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits. It delivers a unified platform with mixed-signal and variation-aware verification capabilities that have superior accuracy, performance, capacity and functionality.

“Verification using Siemens‘ AFS platform on UMC’s production-ready 28HPCU+ process technology reduces the time for proof of analog, improves verification accuracy and accelerates the design process for our shared customers,” said David Chen, senior division director of Technology Development at UMC. “We look forward to continuing our collaboration with Siemens to provide more design and verification tools for a variety of high-growth markets and applications.” 

UMC’s 28HPCU+ platform offers a good balance between cost considerations and chip performance, and is well-suited for a range of applications requiring high-speed and low-power consumption, including integrated circuits (ICs) for Wi-Fi, digital TV and flash controllers applications. Compared to the company’s 28nm technology, the high-performance, low-power 28HPCU+ platform can offer up to a 15 percent boost in performance. 

To learn more about Siemens‘ Analog FastSPICE platform, please visit: https://eda.sw.siemens.com/en-US/ic/analog-fastspice/

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit siemens.com/software or follow us on LinkedIn , Twitter , Facebook and Instagram . Siemens Digital Industries Software – Where today meets tomorrow.

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Contacts for Press

Siemens Digital Industries Software PR Team