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nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens

7. března 2024
Plano, Texas, USA

nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA (image courtesy of nepes corporation)

Siemens Digital Industries Software today announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.

“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”

nepes has an established track record of providing customers with world-class packaging, testing, and semiconductor assembly services for clients throughout the global electronics industry. nepes also offers packaging design services including wafer level packaging, fan-out wafer level packages, and panel level packaging.

Building on this foundation, nepes is now driving additional packaging innovation with a broad range of advanced technologies from Siemens EDA, including the Calibre® nmPlatform, which includes Calibre® 3DSTACK software, HyperLynx™ software for electrical rule checking, as well as Siemens’ industry-leading Xpedition™ Substrate Integrator software and Xpedition™ Package Designer software. Together, these Siemens technologies helped nepes provide fast and reliable design services including 2.5D/3D-based chiplet designs for the company’s growing base of global IC customers.

“Siemens is committed to delivering industry-leading semiconductor packaging technologies to supply chain partners such as nepes, which helps enable them to achieve their digitalization goals,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “As an existing partner and supplier to nepes we are pleased to extend this relationship for the advantage of our mutual customers.”

To learn more about how Siemens is helping the global integrated circuit industry visit https://eda.sw.siemens.com/en-US/

Siemens Digital Industries Software pomáhá firmám všech velikostí s digitální transformací pomocí softwaru, hardwaru a služeb díky platformě Siemens Xcelerator. Software Siemens a komplexní digitální dvojče umožňují společnostem optimalizovat jejich konstrukční, inženýrské a výrobní procesy, aby se z dnešních nápadů staly udržitelné výrobky budoucnosti. Od čipů po celé systémy, od výrobku po procesy, napříč všemi průmyslovými odvětvími. Siemens Digital Industries Software – Accelerating transformation.

Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.

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Siemens Digital Industries Software PR Team
Email: yasmine.can@siemens.com